Come and take a part in designing the next generation of thermal cooling solutions for high-speed communication devices, enjoy working in a meaningful, growing and highly professional environment where you make a significant impact in a technology-focused company. As a team, we support all products NVIDIA develops.
What you will be doing:
Work in a dynamic and challenging environment.
Designing advanced thermal solutions for NVIDIA next generation products, focusing on conduction/ convection based thermal solutions.
Work on variety of challenging thermal designs.
Perform thermal simulation analyzes.
What we need to see:
B.Sc. or M.Sc. in Mechanical Engineering (preferably with an energy focus) or an equivalent degree/experience.
3+ years of experience designing and developing thermal solutions for hardware components.
Strong fundamentals in thermodynamics, fluid mechanics, and heat transfer.
Strong solid understanding of FEA/CFD theory and heat transfer analysis tools, including expert proficiency in at least one thermal simulation software (e.g. IcePak, FloTHERM, Fluent).
Excellent English.
Ways to stand out from the crowd:
Experience in thermal modeling of PCB/boards and electronic components.
Wide knowledge of manufacturing processes and constrains.
Hands-on experience with thermal analysis workflows and design of experiments (DOE).
Experience designing liquid-cooling thermal solutions.
