Join our advanced packaging team to define and develop cutting-edge semiconductor package solutions for automotive-grade digital and RF System-on-Chip (SoC) products.
Youll collaborate with internal teams and external OSATs to deliver high-performance, manufacturable, and reliable packages that meet stringent automotive standards.
What will your job look like:
Define and specify advanced package architectures for digital SoCs and RF ICs in automotive applications.
Perform substrate design for flip-chip BGA (FC-BGA) packages, including stack-up, routing, and ball-out optimizations.
Evaluate and select substrate technologies, materials, and package solutions based on performance, cost, and reliability.
Collaborate with OSATs to define and validate assembly materials and process flows.
Work closely with internal teams such as Backend, SIPI, Product Engineering, and Quality & Reliability to ensure seamless integration.
Monitor yield, quality, and manufacturability across package development and production stages.
Support DFM reviews and ensure compliance with automotive standards and customer requirements
Youll collaborate with internal teams and external OSATs to deliver high-performance, manufacturable, and reliable packages that meet stringent automotive standards.
What will your job look like:
Define and specify advanced package architectures for digital SoCs and RF ICs in automotive applications.
Perform substrate design for flip-chip BGA (FC-BGA) packages, including stack-up, routing, and ball-out optimizations.
Evaluate and select substrate technologies, materials, and package solutions based on performance, cost, and reliability.
Collaborate with OSATs to define and validate assembly materials and process flows.
Work closely with internal teams such as Backend, SIPI, Product Engineering, and Quality & Reliability to ensure seamless integration.
Monitor yield, quality, and manufacturability across package development and production stages.
Support DFM reviews and ensure compliance with automotive standards and customer requirements
Requirements:
B.Sc. or M.Sc. in Electrical Engineering, Materials Science, or a related field.
3+ years of experience in semiconductor package design and assembly.
Deep knowledge of package design, substrate engineering, and simulation methodologies.
Hands-on experience with package layout tools such as Cadence Allegro Package Designer or Xpedition Package Designer.
Solid understanding of high-speed layout constraints (e.g., crosstalk, EMI, RFI) and proven experience with interfaces like DDR, PCIe, MIPI, and UFS.
Strong background in schematic review, capture, and system-level integration.
Proficiency in scripting for automation and design optimization with tools like MATLAB or Python – advantage.
Proficiency in layout design verification tool such as CAM350- advantage.
Experience working directly with OSATs – advantage.
Proven experience with SIPI simulation tools like Ansys SIwave, Ansys HFSS, Cadence Sigrity and Siemens HyperLynx – advantage.
Proven experience with thermal or thermo-mechanical simulation tools like Cadence Celsius, Ansys Icepak, Ansys Mechanical and Flotherm – advantage.
B.Sc. or M.Sc. in Electrical Engineering, Materials Science, or a related field.
3+ years of experience in semiconductor package design and assembly.
Deep knowledge of package design, substrate engineering, and simulation methodologies.
Hands-on experience with package layout tools such as Cadence Allegro Package Designer or Xpedition Package Designer.
Solid understanding of high-speed layout constraints (e.g., crosstalk, EMI, RFI) and proven experience with interfaces like DDR, PCIe, MIPI, and UFS.
Strong background in schematic review, capture, and system-level integration.
Proficiency in scripting for automation and design optimization with tools like MATLAB or Python – advantage.
Proficiency in layout design verification tool such as CAM350- advantage.
Experience working directly with OSATs – advantage.
Proven experience with SIPI simulation tools like Ansys SIwave, Ansys HFSS, Cadence Sigrity and Siemens HyperLynx – advantage.
Proven experience with thermal or thermo-mechanical simulation tools like Cadence Celsius, Ansys Icepak, Ansys Mechanical and Flotherm – advantage.
This position is open to all candidates.
