our company's Networking unit has continuously reinvented itself over two decades. Our high-speed products are leading in the markets with innovative ways to improve speed and bandwidth from one generation to another. Today, we are increasingly known as the place for getting End-to-End High-Speed Ethernet and InfiniBand Solutions. We're looking to grow our company and build our teams with smart people who can join us at the forefront of technological advancement. our company'sIC Packaging design team is looking for a Senior IC Packaging Design Engineer to join our package team. and focus on delivering and designing state of the art high-speed Interconnect systems for Supercomputers and Datacenters. This position will collaborate with Technical Package Lead and cooperation with different design teams and development of complex, detailed layout of IC substrates for our company's products.
What you'll be doing:
As part of a IC Packaging design team, you will collaborate to implement high speed and PDN design for ASIC packages.
Develop symbols, pad stack and perform substrate package routing, placement, stack-up, reference plane, power distribution using Cadence APD (Allegro) or SiP tools.
Optimize package pin out incorporating system level trade-offs of pins assignment.
Develop methodologies to improve layout environment, productivity, reliability, and schedule considerations.
In close co-operation with the SI/PI/HW design teams and product teams
Planning, ensuring stakeholder management and leading projects from start to finish.
What you'll be doing:
As part of a IC Packaging design team, you will collaborate to implement high speed and PDN design for ASIC packages.
Develop symbols, pad stack and perform substrate package routing, placement, stack-up, reference plane, power distribution using Cadence APD (Allegro) or SiP tools.
Optimize package pin out incorporating system level trade-offs of pins assignment.
Develop methodologies to improve layout environment, productivity, reliability, and schedule considerations.
In close co-operation with the SI/PI/HW design teams and product teams
Planning, ensuring stakeholder management and leading projects from start to finish.
Requirements:
B.Sc. Electrical Engineering or an Electrical Practical Engineer certificate or equivalent experience
5+ years hands-on in Package/PCB Layout and outing experience; including high speed design signal integrity practices.
Experience in substrate layout of wire bond and flip chip packages, preferred
Knowledge in substrates or board manufacturing process
Significant background with Cadence Virtuoso and APD (Allegro) or SiP and/or other PCB layout tools
Ways to stand out in the crowd:
Knowledge in Ansys (SIwave, HFSS) or Cadence (Sigrity, PowerSI) simulation tools
Familiarity with Skill language (Cadence) and basic parsing abilities (Python/Perl/Shell-scripting).
B.Sc. Electrical Engineering or an Electrical Practical Engineer certificate or equivalent experience
5+ years hands-on in Package/PCB Layout and outing experience; including high speed design signal integrity practices.
Experience in substrate layout of wire bond and flip chip packages, preferred
Knowledge in substrates or board manufacturing process
Significant background with Cadence Virtuoso and APD (Allegro) or SiP and/or other PCB layout tools
Ways to stand out in the crowd:
Knowledge in Ansys (SIwave, HFSS) or Cadence (Sigrity, PowerSI) simulation tools
Familiarity with Skill language (Cadence) and basic parsing abilities (Python/Perl/Shell-scripting).
This position is open to all candidates.
