Key job responsibilities
1. Own the mechanical-thermal design of Annapurna next-generation Machine Learning sled and rack (including thermal solutions and mechanical challenges on PCB / chassis / rack level).
2. Lead and review mechanical and thermal design performed by ODM partners or contractors and component vendors.
3. Debug mechanical and thermal failures on production data center; drive root-cause to closure; take previous learnings to next products.
4. Design and execute mechanical and thermal experiments in the lab – from DOE through measurement, analysis, and corrective action.
5. Travel to ODM/manufacturer/vendor sites to monitor and review project kickoffs, device bringups and manufacturing lines.
Basic Qualifications
– Bachelor's degree in Mechanical or Electrical Engineering or a related field.
– Knowledge of industry standard CAD & FEA design tools, industry trends, and design for manufacturability.
– 8+ years of experience as a Mechanical and/or Thermal design engineer in the electronics industry.
Preferred Qualifications
– Proficient in leading CAD software (Siemens NX, Inventor, or Creo) and experienced with ECAD-MCAD collaboration tools.
– Proficient in mechanical drawings, GD&T, and tolerance-analysis methods.
– Strong knowledge in industry standards – Ethernet, PCIe, OCP, JDEC.
– Knowledge of fiber optic and copper cabling standards and testing equipment.
– Proven experience designing products for ML/HPC and data center applications.
– Experience with design and testing of liquid cooling solutions, from cold plate to rack level manifolds.
