As a leader of our CPO switch Hardware Engineering team, you'll guide, encourage, and drive a team of highly skilled hardware engineers, providing them with stimulating and ambitious assignments and enabling them to stay creative and motivated while delivering products on schedule.
What You'll Be Doing:
Build the best team to design and execute high-performance CPO (Co Package Optics) switch system from concept to mass production.
Be a key member of the technical leadership team developing world-class CPO switch designs.
This position is hands-on and will require a deep understanding of all technical/engineering aspects of the project with intimate familiarity with the entire development flow. From a technical standpoint, you will lead and support engineering teams in the following areas: specification definition, electrical schematics, opto-mechanical design, component selection, layout guidance, hands-on lab testing, production processes, qualification workflows, micro-architecture development, verification, characterization, design for testability, cost optimization, reliability, and more.
Collaborate with and integrate all HW project disciplines: Board Design, Assembly Process, Mechanics, Thermal, PCB Layout, Process, Production Engineering, Software/Firmware, Procurement, NPI, and more.
Plan and oversee your teams work on multiple simultaneous development projects in coordination with the broader leadership team. Manage direct reports, set goals, provide coaching, conduct performance appraisals, plan careers, and make compensation recommendations.
Collect, examine, and filter requirements from internal customers such as marketing, software, and systems engineering to assemble a comprehensive plan of record for next-generation switches while planning resource allocation for projects and assign team members effectively.
Schedule projects, create realistic outcome estimates, and drive timely, successful execution for high-volume manufacturing.
What We Need to See:
A Bachelor's or Master's degree in Electrical Engineering.
12+ overall years of industry experience in architecture, design, and methodology for cutting-edge board design development.
6+ years of technical design management experience.
Proven experience in leading multi-disciplinary projects, multi-layer, high density PCB design.
A deep understanding of broadband high-speed ICs.
The ability to provide insight and guidance on trade-offs between power, performance, manufacturability, thermals, cost to meet product requirements.
Proven experience with leading execution of highly complex and innovative designs in tight schedule with risk mitigations and detailed planning for first time success.
Strong interpersonal and communication skills, with the ability to quickly build relationships, prioritize conflicting needs, and align teams effectively.
Ways to Stand Out From the Crowd:
Experience in designing data-center networking products for high-volume manufacturing.
Experience with optoelectronics and optical communication systems.
