As a Quality and Reliability (Q&R) Engineer, you will lead the qualification and long-term reliability of advanced System-on-Chip (SoC) and RF semiconductor products for automotive applications. Youll work across digital and RF domains to ensure robust performance and compliance with industry standards.
What will your job look like:
Define and manage Quality and Reliability specifications, simulations, and qualification plans for SoC and RF die and package.
Plan and execute automotive-grade qualifications per standards such as AEC-Q100, JEDEC JESD22, and IATF 16949.
Design and implement die-level and package-level stress tests.
Select and prepare electrical, environmental, and mechanical test platforms for reliability testing.
Define requirements for Pre-Si Q&R (e.g. ESD, LU, EM, IR drop), Design-for-Test (DFT), electrical characterization, and Post-Si Q&R testing of digital, mixed-signal and RF SoCs.
Collaborate extensively with internal design teams, external subcontractors, and outsourcing partners (OSATs).
Lead failure analysis, reliability modeling, and corrective action processes (e.g., 8D, FMEA, FMEDA).
Document and certify automotive standards compliance, including PPAP/APQP deliverables.
What will your job look like:
Define and manage Quality and Reliability specifications, simulations, and qualification plans for SoC and RF die and package.
Plan and execute automotive-grade qualifications per standards such as AEC-Q100, JEDEC JESD22, and IATF 16949.
Design and implement die-level and package-level stress tests.
Select and prepare electrical, environmental, and mechanical test platforms for reliability testing.
Define requirements for Pre-Si Q&R (e.g. ESD, LU, EM, IR drop), Design-for-Test (DFT), electrical characterization, and Post-Si Q&R testing of digital, mixed-signal and RF SoCs.
Collaborate extensively with internal design teams, external subcontractors, and outsourcing partners (OSATs).
Lead failure analysis, reliability modeling, and corrective action processes (e.g., 8D, FMEA, FMEDA).
Document and certify automotive standards compliance, including PPAP/APQP deliverables.
Requirements:
BSc/MSc in Electrical Engineering, Physics, Materials Engineering or related field.
5+ years of experience in semiconductor Q&R, preferably with SoCs, ASICs, VLSI, or RF ICs.
Strong knowledge of semiconductor physics, packaging technologies, materials and reliability mechanisms.
Knowledge and experience with RF reliability concerns.
Experience with advanced packaging Q&R (e.g., FCCSP, FCBGA).
Hands-on experience with Q&R test design and environmental stress testing.
Deep understanding of failure prediction models, reliability simulations, and statistical analysis.
High proficiency in English, including strong verbal, reading, and writing skills.
Expertise in automotive Q&R standards, including AEC-Q100, IATF 16949, and JEDEC/ISO/IEEE protocols -advantage.
Exposure to radar or ADAS/AV automotive systems Q&R – advantage.
BSc/MSc in Electrical Engineering, Physics, Materials Engineering or related field.
5+ years of experience in semiconductor Q&R, preferably with SoCs, ASICs, VLSI, or RF ICs.
Strong knowledge of semiconductor physics, packaging technologies, materials and reliability mechanisms.
Knowledge and experience with RF reliability concerns.
Experience with advanced packaging Q&R (e.g., FCCSP, FCBGA).
Hands-on experience with Q&R test design and environmental stress testing.
Deep understanding of failure prediction models, reliability simulations, and statistical analysis.
High proficiency in English, including strong verbal, reading, and writing skills.
Expertise in automotive Q&R standards, including AEC-Q100, IATF 16949, and JEDEC/ISO/IEEE protocols -advantage.
Exposure to radar or ADAS/AV automotive systems Q&R – advantage.
This position is open to all candidates.
