Package engineer will join IC package development team in Yokneam, leading advanced IC packaging projects at the cutting edge of technology. In this position you will collaborate with the best technical and design teams, plan schedules, resolve costs and lead packaging, manufacturing, and electrical design issues. You will be working with worlds leading manufacturers.
What you'll be doing:
Leading development of cutting-edge microelectronics packaging of our Networking Business Units future products.
Work with world leading vendors to develop highly challenging packaging solutions.
Lead packaging and manufacturing related activities and projects, from R&D to production.
Work in a dynamic and challenging environment.
Join and lead task forces to investigate and support production excursions, failure analysis and reliability issues.
What we need to see:
BSc or equivalent experience in Materials engineering / Mechanical Engineering/ Physics or similar.
At least 5 years of experience in the semiconductor industry, focusing on package development and manufacturing.
Knowledge of mechanical CAD software (Solidworks, Spaceclaim).
Experience with development of mechanical FEA simulations using Ansys software.
Curious and creative problem solver, well organized and multi-tasker.
Team oriented, able to move and motivate peers, strong inter- personal and interpersonal skills (verbal and written).
High awareness for quality, robustness, and manufacturability.
High self-learning and self-motivation skills.
Leadership skills, capability to lead cross company projects that involve cross functional teams in Israel & abroad.
Ways to stand out of the crowd:
Familiar with manufacturing environment and manufacturing statistics tool (for example JMP).
Background in semiconductor manufacturing processes.
Excellent social skills.
