Provide PCB Technology support to the Networking BU Engineering Teams; and also, to Signal Integrity, PCB Design, PCB Sourcing, and OPS Engineering.
Develop close relationships the PCB Supply Base and Material Laminate Suppliers applicable to NBU PCB designs.
Help establish and build optimize PCB stack-ups to improve reliability and with cost avoidance concepts.
Resolve NBU PCB Supplier issues, corrective actions, and prevent issues from reoccurring.
Lead the development of PCB Technology and Material Roadmaps established from NBU Engineering needs and for next generation products.
Own the efforts with all Suppliers such that they are capable and ready to meet the NBU PCB Roadmap requirements; and qualify Suppliers with new technologies and materials.
Lead the Research & Development of new PCB Technologies, Interconnect Structures, and Materials required for new Products, Product performance improvements, and cost reductions prior to the time needed by NBU Engineering.
Frequently communicate and update NBU PCB and Supplier activities with the PCB Team in Santa Clara.
B.Sc./M.Sc. in Chemistry or Materials Engineering with 15+ years' experience related to PCB Design, fabrication, and materials. OEM System level PCB and Backplane experience desirable.
Extensive expertise in all PCB Technologies with a strong background in the Research and Development of laminate materials, PCB interconnect structures, related Chemistries, and fabrication processes.
Proven expertise in HDI, high layer count PCBs, materials, and signal Integrity challenges with high speed (25 Gbps+) signal designs.
The ability to effectively work and connect with various Hardware and Signal Integrity Engineering Teams; and ability to establish very close and respected relationships with these Teams.
A self-driver requiring minimal supervision.
Good leadership and oral/written communications skills.
High motivation and creative thinking skills.
Must be stationed in Israel full time and capable of daily attendance in our office in Yokneam.
