We are a world-class technology company, is seeking a passionate Senior Package Engineer to join our team in Israel. In this role, you will have the opportunity to collaborate with several design and program teams in the development of sophisticated IC substrates for our groundbreaking products. We are committed to delivering exceptional solutions in a wide range of sectors, and we are looking for engineers who share our passion and dedication to making a difference in the world through their inventions. As a Senior Package Engineer, you will work closely with SI, layout, and ASIC design teams to develop complex, top-of-the-line ASIC packages. You will be responsible for planning schedules, resolving costs, packaging, manufacturing, and electrical design issues.
What you'll be doing:
Leading the development of groundbreaking microelectronics packaging for our Networking Business Unit's future products.
Collaborating with world-leading vendors to develop highly ambitious packaging solutions.
Thriving in a dynamic and challenging environment.
Joining and leading task forces to investigate and support production excursions, failure analysis, and reliability issues.
What we need to see:
BSc or equivalent experience in Mechanical Engineering / Materials Engineering / Physics or similar.
At least 5 years of experience with complex ASIC package development and manufacturing.
Hands-on FEA mechanical simulation experience.
Experience co-working with subcontractors and vendors.
Vision and focus for projects and team.
Curious and creative problem solver as well as organized and multi-tasker.
Team oriented, able to move and motivate peers. Strong interpersonal skills (verbal and written).
High awareness of quality, manufacturability and project schedule.
Ways to stand out from the crowd:
Experience with manufacturing environment and manufacturing statistics tools (for example JMP).
Background in semiconductor manufacturing processes.
