We are a semiconductor company established by semiconductor industry veterans and is now part of our Web Services.
We are developing leading edge products, manufactured on leading edge technologies.
We offer a dynamic, open, teamwork environment operating at high pace mode.
Key job responsibilities
Evaluation of packaging and assembly technology roadmap aligned to Annapurna product roadmap.
Engage with product architect and design teams on future products package and assembly needs.
Explore and provide recommendations on both available and future packaging and assembly technologies for Annapurnas products.
Engage with substrate and assembly vendors on future technologies roadmap.
Product development and manufacturing:
Define the substrate and package BOM of the ICs in collaboration with Package Design team and OSATs.
Assume full ownership of mechanical and thermal performance of Annapurna ICs.
In collaboration with HW Dev team optimize mechanical vs. thermal tradeoffs.
Ensure testability of the ICs in collaboration with Test Engineer team.
Work with Assembly, Test and Logistics to define work flows at OSATs (focus on Fab/assembly/test interfaces).
Track assembly and substrate yields and look for ways to improve them.
BASIC QUALIFICATIONS:
5+ years of professional experience in similar role.
B.Sc. or M.Sc. degree in Electrical Engineering, Applied Physics or related fields.
PREFERRED QUALIFICATIONS:
High communication skills.
Dive deep quickly into unfamiliar domains.
Strong analytic and problem-solving skills.
Ability to work independently on multiple issues.
