Responsibilities:
Circuit Design: Create and optimize electronic circuits for high-speed applications.
End-to-End Development: Manage the entire development lifecycle, from planning to customer delivery.
Interface Expertise: Work with high-speed interfaces like JESD204, ETH-10Gbps, and PCIE3/4.
FPGA/SOC Design: Implement FPGA/SOC vehicles using INTEL or XILINX technologies.
Memory Components: Develop fast DDR3/4/LP memory components.
Mixed-Signal Skills: Handle integrated digital and analog components (A2D/D2A).
SI/PI Simulations: Validate designs through signal and power integrity simulations.
Bring-Up Testing: Conduct hardware and software Bring-Up tests.
Documentation: Write characterization documents and technical documentation.
Collaboration: Thrive in a multidisciplinary team environment.
Experience: Minimum 6 years in electronic development, leading card projects.
Interface Knowledge: Familiarity with high-speed interfaces.
FPGA/SOC Design: Proficiency in designing with INTEL or XILINX platforms.
Memory Expertise: Experience in fast DDR3/4/LP memory component design.
Vision and Responsibility: Broad vision, attention to detail, and responsibility.
