We are looking for a highly experienced Senior Mechanical to join our Ethernet Product Hardware Engineering team. The team is responsible for the development of next-generation networking and routing platforms, from board-level design through complete rack-level system integration.
As a Senior Mechanical, you will be responsible for the mechanical and thermal design of complex communication systems deployed within telecom and datacenter racks. You will work closely with Hardware, PCB, System, Manufacturing, and Reliability teams to ensure optimal thermal performance, mechanical robustness, serviceability, and manufacturability throughout the product lifecycle.
As a Senior Mechanical, you will be responsible for the mechanical and thermal design of complex communication systems deployed within telecom and datacenter racks. You will work closely with Hardware, PCB, System, Manufacturing, and Reliability teams to ensure optimal thermal performance, mechanical robustness, serviceability, and manufacturability throughout the product lifecycle.
Requirements:
Bachelor's degree in Mechanical Engineering.
Proven experience in mechanical design of electronic systems / packaging and sheet-metal.
Proven experience designing systems integrated within telecom, networking, or datacenter racks.
Deep understanding of thermal management principles for high-power electronic equipment.
Strong expertise in PCB packaging, component placement considerations, and board-level thermal design.
Advanced proficiency in CAD software such as SolidWorks or equivalent 3D mechanical design tools.
Experience with supporting outsourcing for: heatsink design, airflow optimization, and thermal validation methodologies.
Hands-on experience with laboratory thermal testing, instrumentation, reliability and failure analysis.
Strong understanding of materials, manufacturing processes, tolerances, and mechanical reliability.
Experience working with external manufacturers and suppliers, including teams in Asia, is an advantage.
Excellent communication and collaboration skills with cross-functional engineering teams
Bachelor's degree in Mechanical Engineering.
Proven experience in mechanical design of electronic systems / packaging and sheet-metal.
Proven experience designing systems integrated within telecom, networking, or datacenter racks.
Deep understanding of thermal management principles for high-power electronic equipment.
Strong expertise in PCB packaging, component placement considerations, and board-level thermal design.
Advanced proficiency in CAD software such as SolidWorks or equivalent 3D mechanical design tools.
Experience with supporting outsourcing for: heatsink design, airflow optimization, and thermal validation methodologies.
Hands-on experience with laboratory thermal testing, instrumentation, reliability and failure analysis.
Strong understanding of materials, manufacturing processes, tolerances, and mechanical reliability.
Experience working with external manufacturers and suppliers, including teams in Asia, is an advantage.
Excellent communication and collaboration skills with cross-functional engineering teams
This position is open to all candidates.
