What Youll Be Doing:
Review and define impact of engineering change ECO/ECR) across complex hardware systems.
Evaluating the impact of component, layout, and mechanical changes on hardware functionality, manufacturability, and testability.
Define alternative sources of components for products and products test stations.
Collaborating with cross-functional teams to ensure smooth implementation of changes without compromising product quality.
Supporting DFT (Design for Testability) requirements in the face of ongoing design changes.
Reviewing BOM and layout revisions and assessing ripple effects on power delivery, signal integrity, and thermal performance.
Maintaining change traceability and documentation to meet engineering and compliance standards.
Coordinating with manufacturing and operations teams to ensure product readiness and alignment with production timelines.
What We Need to See:
BSc or MSc in Electrical or Electronics Engineering (with exposure to mechanical systems – a plus).
4 years of HW hands-on experience with validation or systems\modules repair up to components level – NPI leadership starting from early design phase to mass production of complex products.
Preferably in server, networking, or embedded systems.
3+ years working with ECO/ECR processes, board/system-level design, or sustaining engineering and or hands on systems\modules repair up to components level – preferred!
Solid understanding of mechanical interfaces, thermal considerations, and their influence on electronic systems.
Familiarity with DFT principles, signal integrity concepts, and production test environments.
Strong analytical skills, attention to detail, and ability to handle multiple change requests in parallel.
Excellent written and verbal communication skills in English.
Ways to stand out from the crowd:
Solid knowledge with products production process: SMT, assembly and tests (ICT, JTAG, functional tests.
experience in Agile PLM – advantage.
