The team collaborates with the BackEnd team to integrate interfaces into the die, designs package layouts for BGA substrates, and conducts signal and power integrity simulations. The team partners with the system team to develop optimal pin-out and PCB breakout schemes, performs electrical characterization of interfaces, and develops software tools for debug and diagnostics.
As a SIP team member, the scope of your work will be focused on Package substrate layout, with a blend of Signal & Power integrity extractions and simulations, as well as also influencing the DIE I/O structures.
Key job responsibilities:
Design and Layout of large and complex package substrates.
Understanding package substrate technologies and layout design rules.
Proficiency in Signal and Power Integrity considerations.
Layout test studies of Die bump-out structures and Package substrate breakout.
Layout test studies of Package pin-out arrangements and PCB board implementation.
Continuously improve the package design work, by coming up with initiatives that drive efficiency, and in turn help improve quality/cost/schedule of the package layout work.
The position is for an entry level, and we will teach and mentor all aspects of the role. No prior hands-on experience in the above list is required.
Basic Qualifications:
– BSc in Electrical Engineering, fresh graduate to 2 years work experience.
– General background in modern digital interfaces (e.g. PCI, DRAM).
Preferred Qualifications:
– Bachelor's degree in computer science or equivalent.
– Background in PCB layout, even as hobbyist.
– Attention to small details, striving for accurate and high-quality deliverables.
