Our Networking division is a leading supplier of innovative end-to-end InfiniBand and Ethernet connectivity solutions and services for servers and storage. We offer market-leading solutions that include adapter cards, switches, cables, and software to support networking technologies. Our products optimize data center performance and deliver industry-leading bandwidth and scalability. In addition, we serve a wide range of sectors including high performance computing, enterprise, data centers, cloud computing and Web 2.0. We are constantly reinventing ourselves to stay ahead of the market and bring groundbreaking products and services to the industry. Our product line is focused on delivering the most optimized Ethernet solutions for industries like Media and Entertainment as well as any other industry that can benefit from our DataStream and TCP/IP acceleration.
What youll be doing:
Drive all the mechanical design aspects of a Telecommunication System, including PCB design, opto-mechanics, thermal solutions and electro-mechanical packaging.
Drive multiple early design concepts while working in fast-paced product development cycles.
Independently lead product design from concept, through detailed design, and support it during Qualification, NPI and MP stages.
Take part in establishing mechanical building blocks and architectures for data-centers.
Join and lead task forces to investigate and support production excursions, failure analysis and reliability issues.
Collaborate in research of ground-breaking technologies, materials, and processes with other groups to bring in creative ideas that solve ever growing needs.
What we need to see:
B.Sc. in Mechanical Engineering or higher.
5+ years of experience in electro-mechanical product design, including PCB/PCBA design.
Records of taking part in (or leading of) establishment of mechanical architecture of large scale multidisciplinary systems.
Excellent hands-on experience with 3D CAD. Autodesk Inventor or Creo is an advantage.
Strong background in design of components for high-volume manufacturing technologies, such as: Sheet metal stamping, die casting and injection molding.
High awareness for quality and manufacturability, and understanding of statistical tolerance analysis techniques, CTF dimensioning, and GD&T.
Self-motivated with a sharp learning curve and able to work independently and as a teammate.
Strong verbal and written communication skills in both English and Hebrew.
Ways to stand out from the crowd:
Active involvement in development of opto-mechanical telecommunication devices.
Hands on experience in generating and exchanging IDF files with Layout Engineers.
Exposure to development of advanced thermal solutions such as heat-pipes, vapor chamber and liquid cooling.
Experience with mechanical stress simulation tools such as ANSYS Mechanical.
Record of working with supply chains, contract manufacturers and leading resources such as consultants, component suppliers, contractors, and manufacturing partners.
