An amazing start up opening a new Fab is seeking a highly skilled and motivated Lithography Process Engineer to join a cutting-edge semiconductor fabrication facility in Israel. The ideal candidate will play a crucial role in developing, optimizing, and maintaining lithography processes for advanced semiconductor manufacturing.
Key Responsibilities:
Develop and optimize lithography processes for current and next-generation semiconductor devices
Troubleshoot and resolve complex lithography-related issues to improve yield and performance
Collaborate with cross-functional teams, including Process Integration, Design, and OPC, to address systematic defect issues and identify layout-sensitive weak points
Monitor and control lithography processes, ensuring adherence to specifications and quality standards, EBL.
Implement new processes and technologies to enhance production efficiency
Key Responsibilities:
Develop and optimize lithography processes for current and next-generation semiconductor devices
Troubleshoot and resolve complex lithography-related issues to improve yield and performance
Collaborate with cross-functional teams, including Process Integration, Design, and OPC, to address systematic defect issues and identify layout-sensitive weak points
Monitor and control lithography processes, ensuring adherence to specifications and quality standards, EBL.
Implement new processes and technologies to enhance production efficiency
Requirements:
Qualifications:
Bachelor’s or Master’s degree in Electrical Engineering, Chemical Engineering, Physics, or a related field
3+ years of experience in semiconductor lithography processes, preferably in a high-volume manufacturing environment
Strong understanding of photolithography principles, equipment, and materials
Experience with advanced lithography techniques such as immersion lithography and EUV lithography
Proficiency in data analysis and statistical process control methods
Excellent problem-solving skills and ability to work in a fast-paced environment
Strong communication and teamwork skills
Experience with semiconductor industry packaging processes is a plus
Qualifications:
Bachelor’s or Master’s degree in Electrical Engineering, Chemical Engineering, Physics, or a related field
3+ years of experience in semiconductor lithography processes, preferably in a high-volume manufacturing environment
Strong understanding of photolithography principles, equipment, and materials
Experience with advanced lithography techniques such as immersion lithography and EUV lithography
Proficiency in data analysis and statistical process control methods
Excellent problem-solving skills and ability to work in a fast-paced environment
Strong communication and teamwork skills
Experience with semiconductor industry packaging processes is a plus
This position is open to all candidates.
