What youll be doing:
Take part in research and development of next-generation electro-optical devices and EO sub-systems for high-speed communication.
The candidates tasks will include electrical specification of EO sub-systems and evaluation boards, schematic design, component selection and characterization, layout considerations and implementation, Fabrication and Assembly guidance.
Hands-on development and testing within Data Center interconnect lab environment.
What we need to See:
B.Sc./M.S.c.in Electrical Engineering or Practical Engineer certificate.
3-5+ years experience with electro-optical and High-Speed Board Design.
Background in high-frequency and broadband (>20GHz) design.
System-level understanding.
Good SI/PI understanding in perspective of multi-layer PCB design.
Experience in electro-optical and High-Speed lab environment High-end measurements.
Knowledge of electro-optical components: Drivers, CDR, Gearbox, DSP, Lasers, Detectors, Amplifiersetc.
Strong abilities to work as part of a team. Highly motivated.
Ways to stand out from the crowd:
Design and experience with Data-Center environment [Switches/CPU/DPU/GPU]
knowledge in layout extraction and board-level simulation.
Familiar with board-design tools (Cadence environment).
Familiar with NRZ/PAM-4 signaling schemes.
Experience with various communication protocols: SPI, I2C, SerDes, PCIe, Ethernet.
Previous experience as a technician\Practical Engineer at IDF technology units.
